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LMG3422R050RQZR - Texas Instruments

Description: Gate Drivers 600-V 50-m? GaN FET with integrated driver, protection and temperature reporting

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LMG3422R050RQZR - Texas Instruments - PCB symbol
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PCB Footprints
LMG3422R050RQZR - Texas Instruments PCB footprint - Other - Other - RQZ0054A-C01_2023-2
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3D Models
LMG3422R050RQZR - Texas Instruments - 3D model - Other - RQZ0054A-C01_2023-2
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LMG3422R050RQZR Details

  • Manufacturer Part Number:

    LMG3422R050RQZR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Configuration:

    COMPLEX

  • DS Breakdown Voltage-Min:

    600 V

  • Drain-source On Resistance-Max:

    0.055 Ω

  • FET Technology:

    JUNCTION

  • JESD-30 Code:

    S-PQCC-N54

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    1

  • Number of Terminals:

    54

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    GALLIUM NITRIDE

  • Turn-off Time-Max (toff):

    86 ns

  • Turn-on Time-Max (ton):

    56 ns

LMG3422R050RQZR Frequently Asked Questions (FAQs)

  • TI recommends a 2-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat. A minimum of 2 oz copper thickness is recommended. Refer to the TI application note 'LMG3422R050RQZR PCB Layout Guidelines' for more information.
  • Choose an input capacitor with a low ESR (Equivalent Series Resistance) and a high ripple current rating. A 10uF to 22uF ceramic capacitor with an X7R or X5R dielectric is recommended. Ensure the capacitor is rated for the maximum input voltage and can handle the expected ripple current.
  • The enable pin (EN) is a 5V-tolerant input, but it's recommended to keep the voltage between 0V and 3.3V to ensure proper operation. Voltages above 3.3V may cause unpredictable behavior or damage the device.
  • To ensure stability, follow the recommended layout guidelines, use a low-ESR input capacitor, and add a 10nF to 22nF ceramic capacitor between the VIN and GND pins. Additionally, ensure the output capacitor is properly sized and has a low ESR. Refer to the TI application note 'LMG3422R050RQZR Stability and Oscillation Prevention' for more information.
  • The LMG3422R050RQZR is rated for a maximum output current of 2A. However, the actual output current capability depends on the input voltage, output voltage, and thermal conditions. Refer to the datasheet's thermal derating curves to determine the maximum output current for your specific application.

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LMG3422R050RQZR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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