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LMH0024MAX/NOPB - Texas Instruments

Description: Equalizers 3.3-V SMPTE 259M / 344M adaptive cable equalizer 16-SOIC -40 to 85

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LMH0024MAX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - 16-Pin SOIC
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LMH0024MAX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - 16-Pin SOIC
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LMH0024MAX/NOPB Details

  • Manufacturer Part Number:

    LMH0024MAX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Rate:

    540000 Mbps

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.077 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    LINE EQUALIZER

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.91 mm

LMH0024MAX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVA477, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • Proper thermal management is crucial for the LMH0024MAX. Ensure good airflow around the device, use a heat sink if necessary, and follow the thermal design guidelines in the datasheet. Additionally, consider using thermal interface materials (TIMs) to improve heat transfer between the device and the heat sink.
  • Operating the LMH0024MAX beyond its recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It is essential to ensure that the device operates within its specified voltage, current, and temperature ranges to guarantee optimal performance and longevity.
  • To troubleshoot issues with the LMH0024MAX, start by reviewing the application circuit and ensuring that it matches the recommended design. Check for proper power supply decoupling, signal integrity, and component tolerances. Use oscilloscopes and other diagnostic tools to identify the root cause of the issue. Consult the datasheet, application notes, and Texas Instruments' support resources for guidance.
  • Yes, to minimize EMI, use proper PCB layout techniques, such as separating analog and digital grounds, using shielding, and implementing filtering. Additionally, consider using EMI-absorbing materials, and follow the EMI mitigation guidelines in the datasheet and application notes.

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LMH0024MAX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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