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LMH0307SQ/NOPB - Texas Instruments

Description: 3 Gbps HD/SD SDI Dual Output Cable Driver with Cable Detect

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PCB Footprints
LMH0307SQ/NOPB - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RUM0016A+
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3D Models
LMH0307SQ/NOPB - Texas Instruments  - 3D model - Quad Flat No-Lead - RUM0016A+
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LMH0307SQ/NOPB Details

  • Manufacturer Part Number:

    LMH0307SQ/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    WQFN-16

  • Pin Count:

    16

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.72 V

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.465 V

  • Supply Voltage1-Min:

    3.135 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

LMH0307SQ/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMH0307SQ/NOPB involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, using a shielded enclosure and keeping the device away from high-frequency sources can help minimize EMI and noise.
  • The LMH0307SQ/NOPB requires a single 3.3V power supply, and it's recommended to use a low-dropout regulator (LDO) to ensure a clean power supply. Power sequencing is not critical, but it's recommended to power up the device after the power supply has stabilized.
  • The LMH0307SQ/NOPB supports cable lengths up to 10 meters, but the actual length may vary depending on the cable quality and the specific application. It's recommended to use a high-quality, shielded cable with a characteristic impedance of 75 ohms to minimize signal degradation.
  • The LMH0307SQ/NOPB is a flexible device that can be configured for various video formats using the device's registers. For example, to configure the device for HD-SDI, you would need to set the clock frequency to 74.25 MHz, the data rate to 1.485 Gbps, and the video format to HD-SDI. Refer to the datasheet and application notes for specific register settings.
  • The LMH0307SQ/NOPB has a maximum junction temperature of 125°C, and it's recommended to keep the device temperature below 85°C for optimal performance. Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the airflow around the device to prevent overheating.

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LMH0307SQ/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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