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LMH6619MAX/NOPB - Texas Instruments

Description: Operational Amplifiers - Op Amps Dual 130 MHz, 1.25 mA RRIO Operational Amplifiers 8-SOIC -40 to 125

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LMH6619MAX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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LMH6619MAX/NOPB Details

  • Manufacturer Part Number:

    LMH6619MAX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    1.9 µA

  • Bandwidth (3dB)-Nom:

    13 MHz

  • Bias Current-Max (IIB) @25C:

    2.4 µA

  • Common-mode Reject Ratio-Min:

    78 dB

  • Common-mode Reject Ratio-Nom:

    96 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.27 µA

  • Input Offset Voltage-Max:

    750 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -5.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    45 V/us

  • Slew Rate-Nom:

    57 V/us

  • Supply Current-Max:

    3.3 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    63000

  • Voltage Gain-Min:

    6300

  • Wideband:

    YES

  • Width:

    3.9 mm

LMH6619MAX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using bypass capacitors to reduce noise and ringing.
  • The choice of input and output capacitors depends on the specific application and frequency range. In general, X7R or X5R ceramic capacitors with a voltage rating of 10V or higher are recommended. The capacitance value should be chosen based on the desired cutoff frequency and impedance matching requirements.
  • The maximum power dissipation of the LMH6619MAX is dependent on the operating temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C, but this can be derated to 0.7W at 85°C. It's essential to ensure proper thermal management to prevent overheating.
  • Yes, the LMH6619MAX can be used as a unity-gain buffer. However, it's essential to ensure that the input signal is within the recommended common-mode voltage range and that the output is properly terminated to prevent oscillations.
  • To reduce noise and distortion, it's recommended to use proper power supply decoupling, minimize trace lengths, and use shielding or guard rings to reduce electromagnetic interference. Additionally, using a low-noise power supply and ensuring proper impedance matching can also help to reduce noise and distortion.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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