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LMH6642MF/NOPB - Texas Instruments

Description: Single Channel, Low Power, 130MHz, 75mA Rail-to-Rail Output Amplifier

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PCB Footprints
LMH6642MF/NOPB - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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LMH6642MF/NOPB - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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LMH6642MF/NOPB Details

  • Manufacturer Part Number:

    LMH6642MF/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    2.65 µA

  • Bandwidth (3dB)-Nom:

    46 MHz

  • Bias Current-Max (IIB) @25C:

    2.6 µA

  • Common-mode Reject Ratio-Min:

    72 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.8 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • Length:

    2.92 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.22 mm

  • Slew Rate-Min:

    90 V/us

  • Slew Rate-Nom:

    135 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    4.5 mA

  • Supply Voltage Limit-Max:

    13.5 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.953 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    19000

  • Voltage Gain-Min:

    3162.278

  • Wideband:

    NO

  • Width:

    1.6 mm

LMH6642MF/NOPB Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMH6642MF/NOPB is 1.4W, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 90°C/W.
  • To ensure stability, it's recommended to use a compensation capacitor (CC) between the output and the inverting input pins. The value of CC depends on the gain and bandwidth requirements of the application. A good starting point is to use a 10pF to 22pF capacitor.
  • To minimize noise and oscillations, it's recommended to use a star-ground configuration, keep the input and output traces short and symmetrical, and avoid running sensitive traces near the power supply or output pins. Additionally, use a solid ground plane and decouple the power supply pins with 0.1uF capacitors.
  • Yes, the LMH6642MF/NOPB can be used as a unity-gain buffer. However, it's recommended to add a 10Ω to 22Ω resistor in series with the output pin to improve stability and reduce oscillations.
  • The LMH6642MF/NOPB has internal ESD protection, but it's still recommended to use external ESD protection devices, such as TVS diodes or ESD arrays, to protect the device from electrostatic discharge.

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LMH6642MF/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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