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LMH6642MFX/NOPB - Texas Instruments

Description: Single Channel, Low Power, 130MHz, 75mA Rail-to-Rail Output Amplifier

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LMH6642MFX/NOPB - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV (R-PDSO-G5)
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LMH6642MFX/NOPB - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV (R-PDSO-G5)
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LMH6642MFX/NOPB Details

  • Manufacturer Part Number:

    LMH6642MFX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    2.65 µA

  • Bandwidth (3dB)-Nom:

    46 MHz

  • Bias Current-Max (IIB) @25C:

    2.6 µA

  • Common-mode Reject Ratio-Min:

    72 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.8 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • Length:

    2.92 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.22 mm

  • Slew Rate-Min:

    90 V/us

  • Slew Rate-Nom:

    135 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    4.5 mA

  • Supply Voltage Limit-Max:

    13.5 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.953 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    19000

  • Voltage Gain-Min:

    3162.278

  • Wideband:

    NO

  • Width:

    1.6 mm

LMH6642MFX/NOPB Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMH6642MFX/NOPB is 1.4W, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 83.3°C/W.
  • Yes, the LMH6642MFX/NOPB is rated for operation from -40°C to 125°C, making it suitable for high-temperature applications. However, the maximum junction temperature (TJ) should not exceed 150°C.
  • To ensure stability, it's essential to follow proper compensation techniques, such as adding a capacitor in parallel with the feedback resistor or using a series resistor-capacitor (RC) network in the feedback path. Additionally, the datasheet provides guidance on selecting the optimal compensation components.
  • To minimize noise and ensure optimal performance, it's recommended to follow good PCB design practices, such as keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. The datasheet provides additional guidance on PCB design considerations.
  • Yes, the LMH6642MFX/NOPB can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is matched to the source impedance to prevent signal attenuation. Additionally, the output impedance of the device should be considered when driving a load.

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LMH6642MFX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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