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LMH6682MM/NOPB - Texas Instruments

Description: 190MHz Single Supply, Dual and Triple Operational Amplifiers

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LMH6682MM/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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LMH6682MM/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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LMH6682MM/NOPB Details

  • Manufacturer Part Number:

    LMH6682MM/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    30 µA

  • Bandwidth (3dB)-Nom:

    180 MHz

  • Bias Current-Max (IIB) @25C:

    20 µA

  • Common-mode Reject Ratio-Min:

    72 dB

  • Common-mode Reject Ratio-Nom:

    82 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.3 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6.3 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    940 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    19 mA

  • Supply Voltage Limit-Max:

    6.3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    84000

  • Voltage Gain-Min:

    3162.278

  • Wideband:

    YES

  • Width:

    3 mm

LMH6682MM/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also important to follow general high-frequency PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using bypass capacitors to reduce noise and ringing.
  • The choice of input and output capacitors depends on the specific application and frequency range. In general, X7R or X5R ceramic capacitors with a voltage rating of 10V or higher are recommended. The capacitance value should be chosen based on the desired cutoff frequency and impedance matching requirements.
  • The maximum power dissipation of the LMH6682MM/NOPB is 1.4W. To ensure it doesn't overheat, it's essential to provide adequate heat sinking, such as using a thermal pad or a heat sink, and to keep the ambient temperature within the recommended operating range.
  • Yes, the LMH6682MM/NOPB can be used in a differential amplifier configuration. However, it's essential to follow the recommended circuit topology and layout guidelines to ensure common-mode rejection and minimize noise and distortion.
  • Common issues with the LMH6682MM/NOPB can often be attributed to poor PCB layout, inadequate decoupling, or incorrect component selection. To troubleshoot, start by verifying the PCB layout and component selection, then check for oscillation or instability using a spectrum analyzer or oscilloscope.

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LMH6682MM/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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