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LMH6733MQ/NOPB - Texas Instruments

Description: Single Supply, 1.0 GHz, Triple Operational Amplifier

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PCB Footprints
LMH6733MQ/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBQ0016A
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LMH6733MQ/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DBQ0016A
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LMH6733MQ/NOPB Details

  • Manufacturer Part Number:

    LMH6733MQ/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    19 µA

  • Bandwidth (3dB)-Nom:

    480 MHz

  • Bias Current-Max (IIB) @25C:

    19 µA

  • Common-mode Reject Ratio-Min:

    53 dB

  • Common-mode Reject Ratio-Nom:

    55 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2200 µV

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.905 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6.6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    3750 V/us

  • Supply Current-Max:

    21.9 mA

  • Supply Voltage Limit-Max:

    6.6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000000

  • Wideband:

    YES

  • Width:

    3.895 mm

LMH6733MQ/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMH6733MQ involves keeping the input and output traces short and wide, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, the device should be operated within its recommended operating conditions.
  • The maximum power dissipation of the LMH6733MQ is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated at higher temperatures.
  • The LMH6733MQ is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It is recommended to derate the power dissipation and ensure proper thermal management to ensure reliable operation.
  • To troubleshoot oscillations or instability issues, check the PCB layout for any signs of resonance or noise coupling. Ensure that the input and output capacitors are of high quality and have low ESR. Also, check the device's operating conditions and ensure that it is within its recommended specifications.

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LMH6733MQ/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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