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LMP2012MM - Texas Instruments

Description: Op Amp

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LMP2012MM - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK0008A_2024
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LMP2012MM - Texas Instruments  - 3D model - Small Outline Packages - DGK0008A_2024
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LMP2012MM Details

  • Manufacturer Part Number:

    LMP2012MM

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    90 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    60 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e0

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.09 mm

  • Slew Rate-Nom:

    4 V/us

  • Supply Current-Max:

    3 mA

  • Supply Voltage Limit-Max:

    5.8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    31622.7

  • Wideband:

    NO

  • Width:

    3 mm

LMP2012MM Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also important to follow general best practices for op-amp layouts, such as keeping the input and output traces separate, using a solid ground plane, and minimizing parasitic capacitance.
  • The choice of gain resistors depends on the desired gain, bandwidth, and noise requirements. TI provides a gain resistor calculator tool to help with this. Additionally, it's important to consider the resistor's tolerance, temperature coefficient, and parasitic capacitance when selecting gain resistors.
  • The maximum power dissipation of the LMP2012MM is not explicitly stated in the datasheet, but it can be calculated based on the package thermal resistance and the maximum junction temperature. For the MSOP package, the maximum power dissipation is approximately 450mW.
  • Yes, the LMP2012MM can be used as a unity-gain buffer, but it's important to ensure that the input impedance is matched to the source impedance to minimize signal attenuation. Additionally, the output impedance of the op-amp should be considered when driving a load.
  • The LMP2012MM has internal ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Additionally, external ESD protection devices can be added to the circuit if required.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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