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LMP7312MA/NOPB - Texas Instruments

Description: Precision SPI-Programmable AFE with Differential/Single-Ended Input/Output

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PCB Footprints
LMP7312MA/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (-R-PDSO-G14)
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3D Models
LMP7312MA/NOPB - Texas Instruments  - 3D model - Small Outline Packages - D (-R-PDSO-G14)
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LMP7312MA/NOPB Details

  • Manufacturer Part Number:

    LMP7312MA/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    77 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    100000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    1.4 V/us

  • Supply Current-Max:

    2 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1200

  • Voltage Gain-Max:

    1.99

  • Wideband:

    NO

  • Width:

    3.91 mm

LMP7312MA/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using bypass capacitors to reduce noise and oscillations.
  • To ensure stability, it's essential to follow the recommended compensation network, use a stable input voltage, and minimize parasitic capacitance and inductance in the circuit. Additionally, adding a small capacitor (e.g., 10nF) between the output and the inverting input can help to reduce oscillations.
  • The maximum power dissipation of the LMP7312MA is dependent on the package type and the ambient temperature. The datasheet provides a power dissipation calculation formula: Pd = (Vcc x Icc) + (Vout x Iout). It's essential to ensure that the calculated power dissipation is within the recommended limits to prevent overheating and damage to the device.
  • Yes, the LMP7312MA can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is matched to the source impedance, and the output impedance is low enough to drive the load. Additionally, the gain bandwidth product and the slew rate of the op-amp should be considered to ensure that the signal is not distorted or attenuated.
  • To protect the LMP7312MA from ESD and overvoltage, it's recommended to use ESD protection diodes, such as the TVS diode, and overvoltage protection circuits, such as a voltage clamp or a crowbar circuit. Additionally, following proper handling and storage procedures, such as using anti-static bags and wrist straps, can help to prevent ESD damage.

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LMP7312MA/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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