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LMP8602QMM/NOPB - Texas Instruments

Description: SP Amp Current Sense Amp Single 5.5V Automotive 8-Pin VSSOP T/R

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LMP8602QMM/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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LMP8602QMM/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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LMP8602QMM/NOPB Details

  • Manufacturer Part Number:

    LMP8602QMM/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    INSTRUMENTATION AMPLIFIER

  • Common Mode Voltage-Max:

    60 V

  • Common-mode Reject Ratio-Min:

    90 dB

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    R-SDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.07 mm

  • Slew Rate-Nom:

    0.4 V/us

  • Supply Current-Max:

    1.5 mA

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Gain-Nom:

    50

  • Width:

    3 mm

LMP8602QMM/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMP8602QMM involves keeping the input and output traces short and separate, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended PCB layout, use the correct output capacitor value and type, and ensure that the input voltage is within the recommended range. Additionally, adding a small capacitor (e.g., 10nF) between the output and the inverting input can help prevent oscillations.
  • The maximum power dissipation of the LMP8602QMM is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated based on the actual operating conditions.
  • While the LMP8602QMM is a high-performance op-amp, it's not necessarily the best choice for audio applications. The device is optimized for high-speed and high-precision applications, and its noise floor and distortion characteristics may not be suitable for high-fidelity audio applications.
  • To protect the LMP8602QMM from overvoltage and ESD damage, it's essential to use voltage clamps or transient voltage suppressors on the input and output pins. Additionally, following proper ESD handling and storage procedures, such as using anti-static bags and wrist straps, can help prevent damage.

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LMP8602QMM/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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