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LMP91300NHZJ - Texas Instruments

Description: Inductive Proximity Sensor AFE

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PCB Footprints
LMP91300NHZJ - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NHZ0024B
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3D Models
LMP91300NHZJ - Texas Instruments  - 3D model - Quad Flat No-Lead - NHZ0024B
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LMP91300NHZJ Details

  • Manufacturer Part Number:

    LMP91300NHZJ

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16X.2,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    40 V

  • Supply Voltage-Min (Vsup):

    6.5 V

  • Supply Voltage-Nom (Vsup):

    24 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

LMP91300NHZJ Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMP91300NHZJ involves separating the analog and digital grounds, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog power plane and a dedicated digital power plane.
  • To optimize the gain and offset of the LMP91300NHZJ, you can use the internal gain and offset calibration registers. You can also use external resistors to adjust the gain and offset. It's recommended to consult the application note 'LMP91300NHZJ Gain and Offset Calibration' for more information.
  • The recommended power-up sequence for the LMP91300NHZJ is to first apply the analog power supply (AVDD), followed by the digital power supply (DVDD), and then the interface clock signal. This ensures that the device powers up correctly and prevents damage or malfunction.
  • To ensure EMC with the LMP91300NHZJ, it's recommended to use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the analog input lines. Additionally, it's recommended to follow the guidelines outlined in the IEC 61000-4-2 standard for electromagnetic compatibility.
  • The recommended method for thermal management of the LMP91300NHZJ is to use a thermal pad or heat sink on the exposed pad of the device. This helps to dissipate heat and prevent overheating, which can affect the device's performance and reliability.

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LMP91300NHZJ Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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