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LMR36006FSC3RNXRQ1 - Texas Instruments

Description: 0.6-A Ultra-small synchronous step-down converter

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LMR36006FSC3RNXRQ1 - Texas Instruments PCB footprint - Other - Other - RNX0012B_FFW
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LMR36006FSC3RNXRQ1 - Texas Instruments  - 3D model - Other - RNX0012B_FFW
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LMR36006FSC3RNXRQ1 Details

  • Manufacturer Part Number:

    LMR36006FSC3RNXRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-11-18

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    PFM CONTROL ALSO POSSIBLE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    60 V

  • Input Voltage-Min:

    4.2 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-PQCC-N12

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.6 A

  • Output Voltage-Max:

    57 V

  • Output Voltage-Min:

    1 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC12(UNSPEC)

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2100 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

LMR36006FSC3RNXRQ1 Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to follow the PCB layout guidelines provided in the Texas Instruments application note 'LMR36xx PCB Layout Guidelines' (SLVAE04). This includes using a solid ground plane, placing thermal vias under the device, and keeping the thermal path as short as possible.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using thermal management techniques such as heat sinks, thermal interfaces, and airflow management to keep the device temperature within the specified range.
  • The recommended input and output capacitors for the LMR36006FSC3RNXRQ1 are ceramic capacitors with a voltage rating of at least 10V and a capacitance value of 10uF to 22uF. The capacitor selection should be based on the specific application requirements and the desired level of ripple rejection.
  • To troubleshoot issues with the device's enable pin, ensure that the enable pin is properly connected to a logic-level signal source, and that the signal is within the specified voltage range. Also, verify that the enable pin is not being pulled low by an external circuit or component. If issues persist, consult the datasheet and application notes for further guidance.
  • The recommended method for soldering the LMR36006FSC3RNXRQ1 is to use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Ensure that the device is properly aligned and secured to the PCB during the soldering process to prevent damage or misalignment.

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LMR36006FSC3RNXRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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