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LMR36503MSCQRPERQ1 - Texas Instruments

Description: Switching Voltage Regulators Automotive 3-V to 65-V, 0.3-A buck converter optimized for size and light load efficiency 9-VQFN-HR -40 to 150

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LMR36503MSCQRPERQ1 - Texas Instruments PCB footprint - Other - Other - RPE0009A_2
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LMR36503MSCQRPERQ1 - Texas Instruments  - 3D model - Other - RPE0009A_2
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LMR36503MSCQRPERQ1 Details

  • Manufacturer Part Number:

    LMR36503MSCQRPERQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2020-02-22

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    65 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-XBCC-N9

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.3 A

  • Output Voltage-Max:

    28 V

  • Output Voltage-Min:

    1 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    BCC

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom (Vsup):

    24 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2200 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    UNSPECIFIED

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

LMR36503MSCQRPERQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal relief pattern can help to dissipate heat efficiently.
  • To ensure reliable start-up and shutdown, it is recommended to add a soft-start circuit to limit the inrush current, and to use a voltage supervisor to monitor the input voltage and ensure that the device is powered up and down correctly.
  • To ensure EMI and EMC compliance, it is essential to follow good PCB layout practices, such as keeping the switching node away from sensitive analog circuits, using a common-mode choke, and adding EMI filters to the input and output lines.
  • To optimize the device for low IQ operation, it is recommended to use a low-IQ mode, disable unnecessary features, and adjust the switching frequency to minimize power consumption. Additionally, using a low-VIN, low-IQ LDO regulator can help to reduce the overall system power consumption.
  • To ensure reliable operation, it is essential to consider thermal design and heat sinking. This includes selecting a suitable heat sink, applying thermal interface material, and ensuring good airflow around the device.

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LMR36503MSCQRPERQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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