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LMR64010XMF/NOPB - Texas Instruments

Description: SIMPLE SWITCHER® 2.7V to 14V, 1A Step-Up Regulator in SOT-23 Package

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PCB Footprints
LMR64010XMF/NOPB - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005
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3D Models
LMR64010XMF/NOPB - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005
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LMR64010XMF/NOPB Details

  • Manufacturer Part Number:

    LMR64010XMF/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES IN ADJUSTABLE MODE UP TO 40V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    14 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    40 V

  • Output Voltage-Min:

    3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.45 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    1600 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

LMR64010XMF/NOPB Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Monitor the input voltage, output current, and junction temperature to ensure they are within the recommended operating conditions specified in the datasheet. Use proper thermal management and PCB design to prevent overheating.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potential device failure. It is essential to ensure the device operates within the recommended temperature range to maintain reliability and performance.
  • Check the input voltage, output current, and PCB layout for any issues. Verify that the device is properly soldered and that the thermal pad is connected to a solid ground plane. Consult the datasheet and application notes for troubleshooting guidelines.
  • Yes, the LMR64010XMF/NOPB is qualified for automotive and high-reliability applications. However, it is essential to follow the recommended operating conditions, PCB design, and thermal management guidelines to ensure reliable operation.

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LMR64010XMF/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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