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LMS3655LQRNLTQ1 - Texas Instruments

Description: 3.5A /5.5A, 36V Synchronous, 400kHz, Step-Down Converter

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PCB Footprints
LMS3655LQRNLTQ1 - Texas Instruments PCB footprint - Other - Other - RNL0022A_2020
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LMS3655LQRNLTQ1 - Texas Instruments  - 3D model - Other - RNL0022A_2020
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LMS3655LQRNLTQ1 Details

  • Manufacturer Part Number:

    LMS3655LQRNLTQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2016-12-07

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    42 V

  • Input Voltage-Min:

    3.5 V

  • Input Voltage-Nom:

    13.5 V

  • JESD-30 Code:

    R-PQCC-N22

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    22

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    5.5 A

  • Output Voltage-Max:

    15 V

  • Output Voltage-Min:

    1 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCN

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    500 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

LMS3655LQRNLTQ1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
  • Use the TI Webench tool or consult the application note SLUA623 for guidance on designing an optimal output filter. Consider the output voltage, current, and desired ripple voltage when selecting components.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 10-22 μF is recommended. Ensure the capacitor is rated for the input voltage and has a low impedance at the switching frequency.
  • Monitor the input voltage, output current, and junction temperature to ensure they remain within the specified limits. Implement overcurrent protection and thermal monitoring to prevent damage.
  • Keep high-current paths short and wide, and avoid sharp corners or narrow traces. Use a 2-ounce copper layer and consider using a dedicated power plane for the high-current paths.

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LMS3655LQRNLTQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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