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LMV1032UPX-06/NOPB - Texas Instruments

Description: Microphone Preamplifiers Amplifiers for 3-Wire Analog Electret Microphones 4-DSBGA -40 to 85

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LMV1032UPX-06/NOPB - Texas Instruments PCB footprint - BGA - BGA - YPC0004
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LMV1032UPX-06/NOPB - Texas Instruments  - 3D model - BGA - YPC0004
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LMV1032UPX-06/NOPB Details

  • Manufacturer Part Number:

    LMV1032UPX-06/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    120 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    6.2 dB

  • Harmonic Distortion:

    0.11%

  • JESD-30 Code:

    S-PBGA-B4

  • JESD-609 Code:

    e1

  • Length:

    1.1535 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.395 mm

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage-Max (Vsup):

    5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.1535 mm

LMV1032UPX-06/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines for input and output signals.
  • To ensure stability, follow the recommended compensation network values and layout, and ensure that the device is operated within the recommended operating conditions. Additionally, use a low-ESR capacitor for the power supply decoupling and avoid using long traces or wires for the feedback network.
  • The maximum power dissipation of the LMV1032UPX-06/NOPB is dependent on the operating conditions, such as ambient temperature and thermal resistance. Refer to the thermal characteristics section in the datasheet for more information. As a general rule, ensure that the device is operated within the recommended operating conditions and that the thermal design is adequate to prevent overheating.
  • The LMV1032UPX-06/NOPB is rated for operation up to 125°C, but the device's performance and reliability may degrade at high temperatures. Ensure that the device is operated within the recommended operating conditions and that the thermal design is adequate to prevent overheating. Consult the datasheet and application notes for more information on high-temperature operation.
  • Common issues such as noise or distortion can be troubleshooted by checking the power supply decoupling, ensuring that the device is operated within the recommended operating conditions, and verifying that the input and output signals are within the recommended specifications. Consult the datasheet and application notes for more information on troubleshooting common issues.

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LMV1032UPX-06/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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