LMV112SD - Texas Instruments

LMV112SD Details

• Manufacturer Part Number:

  LMV112SD

• Brand Name:

  Texas Instruments

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  SOIC

• Package Description:

  LLP-8

• Pin Count:

  8

• ECCN Code:

  EAR99

• HTS Code:

  8542.33.00.01

• Manufacturer:

  Texas Instruments

• YTEOL:

  0

• Amplifier Type:

  BUFFER

• Bandwidth (3dB)-Nom:

  40 MHz

• JESD-30 Code:

  S-PDSO-N8

• JESD-609 Code:

  e0

• Length:

  3 mm

• Moisture Sensitivity Level:

  1

• Number of Functions:

  2

• Number of Terminals:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HVSON

• Package Shape:

  SQUARE

• Package Style:

  SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  0.8 mm

• Slew Rate-Nom:

  110 V/us

• Supply Current-Max:

  3.8 mA

• Supply Voltage Limit-Max:

  5.5 V

• Supply Voltage-Nom (Vsup):

  2.7 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  TIN LEAD

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  DUAL

• Width:

  3 mm