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LMV551MG/NOPB - Texas Instruments

Description: Texas Instruments LMV551MG/NOPB Micropower Op Amp, 3MHz Rail-Rail, 2.7 → 5.5 V, 5-Pin SC-70

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PCB Footprints
LMV551MG/NOPB - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DCK-05-1
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LMV551MG/NOPB - Texas Instruments  - 3D model - SOT23 (5-Pin) - DCK-05-1
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LMV551MG/NOPB Details

  • Manufacturer Part Number:

    LMV551MG/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.038 µA

  • Bias Current-Max (IIB) @25C:

    0.038 µA

  • Common-mode Reject Ratio-Min:

    76 dB

  • Common-mode Reject Ratio-Nom:

    93 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.02 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    0.046 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    3980

  • Wideband:

    NO

  • Width:

    1.25 mm

LMV551MG/NOPB Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMV551MG/NOPB is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • Yes, the LMV551MG/NOPB is rated for operation from -40°C to 125°C, making it suitable for high-temperature applications. However, the device's performance may degrade at higher temperatures, and the maximum junction temperature (TJ) should not exceed 150°C.
  • To ensure stability, it's essential to follow proper compensation techniques, such as adding a capacitor in the feedback loop or using a resistor in series with the feedback capacitor. Additionally, the datasheet provides guidance on stability analysis and compensation techniques.
  • To minimize noise and ensure optimal performance, it's recommended to use a star-grounding technique, where the grounds of the power supplies, analog circuits, and digital circuits are connected at a single point. Additionally, keep the layout compact, and use short traces and low-impedance paths to minimize noise and radiation.
  • While the LMV551MG/NOPB can be used as a comparator, it's not the most suitable device for this application. The device's output stage is designed for linear operation, and its output voltage swing may not be rail-to-rail. For comparator applications, a dedicated comparator IC is recommended.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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