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LMV551QDCKRQ1 - Texas Instruments

Description: Operational Amplifiers - Op Amps Automotive 3-MHz, Micropower RRO Amplifier 5-SC70 -40 to 125

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PCB Footprints
LMV551QDCKRQ1 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DCK(R-PDSO-G5)
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3D Models
LMV551QDCKRQ1 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DCK(R-PDSO-G5)
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LMV551QDCKRQ1 Details

  • Manufacturer Part Number:

    LMV551QDCKRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2017-02-13

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.038 µA

  • Bias Current-Max (IIB) @25C:

    0.038 µA

  • Common-mode Reject Ratio-Min:

    76 dB

  • Common-mode Reject Ratio-Nom:

    93 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.02 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    0.046 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    3548.134

  • Wideband:

    NO

  • Width:

    1.25 mm

LMV551QDCKRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-grounded layout with a solid ground plane, and to keep the input and output traces as short as possible. Additionally, it's recommended to use a low-ESR capacitor for decoupling and to place it as close to the device as possible.
  • To ensure stability, it's essential to follow the recommended compensation techniques outlined in the datasheet, such as using a compensation capacitor and resistor in the feedback loop. Additionally, it's crucial to consider the op-amp's gain-bandwidth product, phase margin, and output impedance when designing the circuit.
  • The maximum power dissipation of the LMV551QDCKRQ1 is dependent on the ambient temperature and the thermal resistance of the package. The maximum power dissipation can be calculated using the formula: Pd = (TJ - TA) / θJA, where Pd is the power dissipation, TJ is the junction temperature, TA is the ambient temperature, and θJA is the thermal resistance. The datasheet provides the thermal resistance values for different packages.
  • The LMV551QDCKRQ1 is rated for operation up to 125°C, but the device's performance and reliability may degrade at higher temperatures. It's essential to consider the device's temperature coefficient, thermal resistance, and power dissipation when designing for high-temperature applications.
  • To protect the LMV551QDCKRQ1 from ESD, it's recommended to follow standard ESD handling procedures, such as using an ESD wrist strap, mat, or workstation. Additionally, the device should be handled by the body only, and not by the leads. During assembly, it's essential to follow proper soldering techniques and avoid applying excessive heat or mechanical stress to the device.

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LMV551QDCKRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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