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LMV552MM - Texas Instruments

Description: Specified 3-V and 5-V Performance • High Unity Gain Bandwidth 3 MHz • Supply Current (Per Amplifier) 37 µA • CMRR 93 dB • PSRR 90 dB • Slew Rate 1 V/µs • Output Swing With 100-kΩ Load 70 mV From Rail • Total Harmonic Distortion: 0.003% at 1 kHz, 2 kΩ • Temperature Range: −40°C to 125°C

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LMV552MM - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK0008A
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LMV552MM - Texas Instruments  - 3D model - Small Outline Packages - DGK0008A
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LMV552MM Details

  • Manufacturer Part Number:

    LMV552MM

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.038 µA

  • Bias Current-Max (IIB) @25C:

    0.038 µA

  • Common-mode Reject Ratio-Min:

    72 dB

  • Common-mode Reject Ratio-Nom:

    92 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e0

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.09 mm

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    104 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    7943.2

  • Wideband:

    NO

  • Width:

    3 mm

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image LMV552MM/NOPB Texas Instruments

Operational Amplifier, 2 Func, 3000uV Offset-Max, BICMOS, PDSO8

Part Image LMV552MM/NOPB National Semiconductor Corporation

Operational Amplifier, 2 Func, 4500uV Offset-Max, PDSO8

Part Image LMV552MM National Semiconductor Corporation

Operational Amplifier, 2 Func, 4.5uV Offset-Max, PDSO8

Part Image LMV552MMX/NOPB National Semiconductor Corporation

Operational Amplifier, 2 Func, 4500uV Offset-Max, PDSO8

Part Image LMV552MMX Texas Instruments

Operational Amplifier, 2 Func, 4500uV Offset-Max, BICMOS, PDSO8

For a full list of alternate parts for LMV552MM, check out Findchips.com