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LMV715IDBVR - Texas Instruments

Description: OP Amp Single GP R-R I/O 5V 6-Pin SOT-23

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PCB Footprints
LMV715IDBVR - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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3D Models
LMV715IDBVR - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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LMV715IDBVR Details

  • Manufacturer Part Number:

    LMV715IDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 6 PIN

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Bias Current-Max (IIB) @25C:

    0.000004 µA

  • Common-mode Reject Ratio-Min:

    50 dB

  • Common-mode Reject Ratio-Nom:

    75 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3200 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    5 V/us

  • Supply Current-Max:

    1.9 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5000

  • Voltage Gain-Min:

    6300

  • Wideband:

    NO

  • Width:

    1.6 mm

LMV715IDBVR Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMV715IDBVR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended PCB layout, use a low-ESR capacitor for decoupling, and avoid parasitic inductance in the input and output traces. Additionally, the device's output should be loaded with a minimum of 1kΩ to prevent oscillations.
  • The maximum power dissipation of the LMV715IDBVR is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated based on the operating temperature and the thermal resistance of the package.
  • The LMV715IDBVR is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the device's thermal characteristics and ensure proper heat sinking and cooling in high-temperature applications.
  • To protect the LMV715IDBVR from ESD and overvoltage, it's recommended to use ESD protection devices such as TVS diodes or ESD protection arrays at the input and output pins. Additionally, overvoltage protection devices such as voltage regulators or overvoltage protection ICs can be used to prevent damage from voltage transients.

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LMV715IDBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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