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LMV762QMAX/NOPB - Texas Instruments

Description: Comparator Dual 5.25V Automotive 8-Pin SOIC T/R

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PCB Footprints
LMV762QMAX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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LMV762QMAX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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LMV762QMAX/NOPB Details

  • Manufacturer Part Number:

    LMV762QMAX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.000005 µA

  • Bias Current-Max (IIB) @25C:

    0.000005 µA

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    120 ns

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1.4 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.91 mm

LMV762QMAX/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMV762QMAX/NOPB involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended PCB layout, use a low-ESR capacitor for decoupling, and avoid parasitic inductance in the input and output traces. Additionally, the device's gain-bandwidth product should be considered when selecting the compensation capacitor.
  • The maximum power dissipation of the LMV762QMAX/NOPB is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated based on the operating temperature and thermal resistance.
  • The LMV762QMAX/NOPB is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the device's thermal characteristics and ensure proper heat sinking and cooling in high-temperature applications.
  • The selection of the compensation capacitor depends on the desired closed-loop bandwidth, gain, and stability requirements. A general rule of thumb is to choose a capacitor value that sets the pole frequency to about 1/3 to 1/5 of the desired closed-loop bandwidth. The datasheet provides a compensation capacitor selection guide to help with this process.

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LMV762QMAX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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