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LMV772MA - Texas Instruments

Description: Operational Amplifiers

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LMV772MA - Texas Instruments PCB footprint - Other - Other - SOIC127P620X175-8N
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LMV772MA - Texas Instruments  - 3D model - Other - SOIC127P620X175-8N
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LMV772MA Details

  • Manufacturer Part Number:

    LMV772MA

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    PLASTIC, MS-012AA, SOIC-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00025 µA

  • Bias Current-Max (IIB) @25C:

    0.0001 µA

  • Common-mode Reject Ratio-Min:

    79 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1200 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e0

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    235

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    1.4 V/us

  • Supply Current-Max:

    1.92 mA

  • Supply Voltage Limit-Max:

    5.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Unity Gain BW-Nom:

    3500

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3.9 mm

LMV772MA Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with short traces, avoiding 90-degree corners and using a solid ground plane. Place the op-amp close to the signal source, and use a decoupling capacitor (e.g., 0.1 μF) between the power supply pins and ground. Additionally, consider using a shielded enclosure and minimizing the loop area of the input and output traces.
  • To ensure stability, use a compensation capacitor (e.g., 10 pF to 100 pF) between the output and the inverting input pins. This helps to reduce the phase shift and prevent oscillations. Additionally, consider using a resistor (e.g., 1 kΩ to 10 kΩ) in series with the feedback path to improve stability.
  • The LMV772MA can drive capacitive loads up to 1 nF without oscillating. However, it's recommended to use a series resistor (e.g., 100 Ω to 1 kΩ) to dampen the load and prevent oscillations. For larger capacitive loads, consider using a buffer stage or a dedicated op-amp with a higher capacitive drive capability.
  • Use input protection diodes (e.g., 1N4148 or 1N914) connected between the input pins and the power supply rails to clamp the input voltage. Additionally, consider using a voltage limiter or a resistive divider network to reduce the input voltage to within the op-amp's specified range.
  • To prevent latch-up and ensure proper operation, power up the LMV772MA in the following sequence: 1) Apply the power supply voltage to the VCC pin, 2) Apply the input signal, and 3) Apply the output load. Avoid applying the input signal or output load before the power supply voltage is stable.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image LMV772MA Rochester Electronics LLC

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Part Image LMV772MAX/NOPB National Semiconductor Corporation

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