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LMV772MM/NOPB - Texas Instruments

Description: Single/Dual/Quad, Low Offset, Low Noise, RRO Operational Amplifiers

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LMV772MM/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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LMV772MM/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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LMV772MM/NOPB Details

  • Manufacturer Part Number:

    LMV772MM/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00025 µA

  • Bias Current-Max (IIB) @25C:

    0.0001 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0001 µA

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1.4 V/us

  • Supply Current-Max:

    1.9 mA

  • Supply Voltage Limit-Max:

    5.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3500

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3 mm

LMV772MM/NOPB Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMV772MM/NOPB is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • Yes, the LMV772MM/NOPB is rated for operation from -40°C to 125°C, making it suitable for high-temperature applications. However, the device's performance may degrade at higher temperatures, and the maximum junction temperature (TJ) should not exceed 150°C.
  • To ensure stability, it's essential to follow proper PCB layout practices, use a low-ESR capacitor for decoupling, and avoid capacitive loading on the output. Additionally, the gain and phase margins should be checked to ensure the amplifier is stable in the desired frequency range.
  • A good layout and grounding technique for the LMV772MM/NOPB involves using a star-ground configuration, keeping the input and output traces short and symmetrical, and using a solid ground plane to minimize noise and electromagnetic interference (EMI).
  • While the LMV772MM/NOPB can be used as a comparator, it's not the most suitable device for this application. The device's output stage is designed for linear operation, and its response time may be slower than a dedicated comparator. If a comparator is needed, a dedicated comparator IC like the LMV721 or LMV761 is recommended.

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LMV772MM/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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