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LMV796MF - Texas Instruments

Description: OP AMP

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PCB Footprints
LMV796MF - Texas Instruments PCB footprint - Other - Other - SOT95P285X120-5N
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LMV796MF - Texas Instruments  - 3D model - Other - SOT95P285X120-5N
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LMV796MF Details

  • Manufacturer Part Number:

    LMV796MF

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 5 PIN

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000001 µA

  • Bias Current-Max (IIB) @25C:

    0.000001 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    94 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1350 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e0

  • Length:

    2.92 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.22 mm

  • Slew Rate-Nom:

    8.5 V/us

  • Supply Current-Max:

    1.75 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.953 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    14000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    1.6 mm

LMV796MF Frequently Asked Questions (FAQs)

  • Texas Instruments provides a detailed application note (SLVAE03) that covers PCB layout and design considerations for high-frequency op-amps like the LMV796MF. It recommends using a symmetrical layout, minimizing trace lengths, and using a solid ground plane to reduce noise and parasitic inductance.
  • The output capacitor (CO) should be chosen based on the desired closed-loop bandwidth and stability. A general rule of thumb is to choose a CO value that is 10-20 times the input capacitor (CI) value. For the LMV796MF, a CO value of 10-22nF is typically recommended.
  • The maximum power dissipation for the LMV796MF is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature, but this can be derated to 0.7W at 85°C ambient temperature.
  • Yes, the LMV796MF can be used as a unity-gain buffer, but it's not the most ideal application due to its high bandwidth and gain. The datasheet recommends using a gain of 2 or higher to ensure stability and minimize peaking. However, if a unity-gain buffer is required, it's essential to add a 10-20 ohm resistor in series with the output to prevent oscillations.
  • To minimize EMI and RFI with the LMV796MF, it's essential to use proper shielding, grounding, and layout techniques. Use a metal shield around the op-amp, connect the shield to the analog ground, and keep the input and output traces as short as possible. Additionally, use a common-mode choke or ferrite bead on the input and output lines to filter out high-frequency noise.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image LMV796MF Rochester Electronics LLC

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Part Image LMV796QMF/NOPB National Semiconductor Corporation

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Part Image LMV796MFX/NOPB National Semiconductor Corporation

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Part Image LMV796QMFX/NOPB National Semiconductor Corporation

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