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LMV822DR - Texas Instruments

Description: Operational Amplifiers - Op Amps Dual Low-Voltage Low Power RRO

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LMV822DR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G8)
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LMV822DR - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G8)
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LMV822DR Details

  • Manufacturer Part Number:

    LMV822DR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, MS-012AA, SOIC-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.14 µA

  • Bias Current-Max (IIB) @25C:

    0.1 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1.4 V/us

  • Slew Rate-Nom:

    1.7 V/us

  • Supply Current-Max:

    0.9 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3.9 mm

LMV822DR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMV822DR is dependent on the ambient temperature and the package type. For the SOIC package, the maximum power dissipation is 670mW at 25°C. However, it's recommended to derate the power dissipation by 6.7mW/°C above 25°C.
  • While the LMV822DR is an op-amp, it's not recommended to use it as a comparator. The op-amp is designed for linear applications, and its output stage is not optimized for high-speed switching. Using it as a comparator may result in oscillations, latch-up, or other unintended behavior.
  • The input impedance of the LMV822DR is typically around 10MΩ, but it can vary depending on the frequency and the input signal. It's recommended to use an input resistor to match the impedance of the signal source and to reduce noise pickup.
  • The LMV822DR is rated for operation up to 125°C, but its performance may degrade at high temperatures. The op-amp's bandwidth, slew rate, and noise performance may be affected, and the device may not meet its specified parameters. It's recommended to consult the datasheet and application notes for more information on high-temperature operation.
  • To achieve optimal performance with the LMV822DR, it's recommended to follow good PCB layout practices, such as keeping the input and output traces short and separate, using a solid ground plane, and minimizing noise coupling. It's also recommended to use a low-ESR capacitor for power supply decoupling and to place it close to the op-amp.

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LMV822DR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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