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LMV822M - Texas Instruments

Description: Op Amps

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LMV822M - Texas Instruments PCB footprint - Other - Other - SOIC127P600X175-8N
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LMV822M - Texas Instruments  - 3D model - Other - SOIC127P600X175-8N
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LMV822M Details

  • Manufacturer Part Number:

    LMV822M

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SO-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    1998-03-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.14 µA

  • Bias Current-Max (IIB) @25C:

    0.1 µA

  • Common-mode Reject Ratio-Min:

    72 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.03 µA

  • Input Offset Voltage-Max:

    3500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e0

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    235

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1.4 V/us

  • Slew Rate-Nom:

    2 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.7 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Unity Gain BW-Nom:

    5600

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3.9 mm

LMV822M Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMV822M is dependent on the package type and thermal resistance. For the VSSOP-8 package, the maximum power dissipation is approximately 450mW at 25°C ambient temperature.
  • To minimize noise and ensure optimal performance, it is recommended to follow good PCB layout practices such as separating analog and digital grounds, using a solid ground plane, and keeping sensitive analog signals away from noisy digital signals. Additionally, it is recommended to place the op-amp close to the signal source and use short, direct traces to minimize parasitic inductance and capacitance.
  • The recommended capacitor value for decoupling the power supply pins of the LMV822M is 0.1uF to 1uF, depending on the specific application and noise requirements. A higher value capacitor can be used for more demanding noise environments.
  • While the LMV822M is an op-amp and not a dedicated comparator, it can be used as a comparator in certain applications. However, it is not recommended for high-speed or high-frequency comparator applications due to its limited slew rate and bandwidth. Additionally, the output stage of the LMV822M is not designed for high-current drive, so it may not be suitable for driving heavy loads.
  • The LMV822M has built-in ESD protection, but it is still recommended to follow good ESD handling practices during assembly and testing. This includes using ESD-safe materials, grounding oneself before handling the device, and using ESD protection devices such as TVS diodes or ESD arrays on the PCB.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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