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LMV824M - Texas Instruments

Description: I.C. LMV824M

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LMV824M Details

  • Manufacturer Part Number:

    LMV824M

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-14

  • Pin Count:

    14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.14 µA

  • Bias Current-Max (IIB) @25C:

    0.1 µA

  • Common-mode Reject Ratio-Min:

    68 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e0

  • Length:

    8.65 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    235

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1.4 V/us

  • Slew Rate-Nom:

    1.5 V/us

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Unity Gain BW-Nom:

    5000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3.9 mm

LMV824M Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with short traces, avoiding vias and layer changes. Place the op-amp close to the signal source, and use a ground plane to reduce noise and EMI. Additionally, use decoupling capacitors (e.g., 0.1 μF) between the power supply pins and ground to filter out high-frequency noise.
  • The gain resistors (R1 and R2) should be chosen based on the desired gain and bandwidth. A higher gain requires smaller resistors, but may compromise bandwidth. Use the op-amp's gain-bandwidth product (GBW) to determine the maximum gain for a given bandwidth. For example, for a GBW of 1 MHz, a gain of 10 would require R1 = 1 kΩ and R2 = 10 kΩ.
  • The LMV824M can drive capacitive loads up to 1 nF without oscillation or instability. However, it's recommended to use a series resistor (e.g., 100 Ω) to dampen the load and prevent ringing. For larger capacitive loads, consider using a buffer stage or a dedicated op-amp with higher drive capability.
  • To ensure stability, ensure that the feedback loop has a phase margin of at least 45°. This can be achieved by using a compensation capacitor (e.g., 10 pF) between the output and the inverting input. Additionally, use a low-ESR capacitor (e.g., ceramic or film) for the power supply decoupling to prevent oscillation.
  • The LMV824M's performance is affected by temperature, with changes in offset voltage, gain, and bandwidth. The op-amp's offset voltage can drift by up to 10 μV/°C, and the gain can vary by up to 0.01 dB/°C. Ensure that your design takes into account these temperature-related variations to maintain accuracy and stability.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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