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LMZ22003TZ/NOPB - Texas Instruments

Description: Non-Isolated PoL Module DC DC Converter 1 Output 0.8 ~ 6V 3A 6V - 20V Input

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PCB Footprints
LMZ22003TZ/NOPB - Texas Instruments PCB footprint - Other - Other - NDW0007A_2023-1
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3D Models
LMZ22003TZ/NOPB - Texas Instruments  - 3D model - Other - NDW0007A_2023-1
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LMZ22003TZ/NOPB Details

  • Manufacturer Part Number:

    LMZ22003TZ/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SIP

  • Pin Count:

    7

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    6 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PSSO-G7

  • JESD-609 Code:

    e3

  • Length:

    10.16 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Max:

    6 V

  • Output Voltage-Min:

    0.8 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    4.58 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    950 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9.85 mm

LMZ22003TZ/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMZ22003TZ/NOPB involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, the input and output capacitors should be selected based on the specific application requirements, and the device should be operated within its recommended operating conditions.
  • The LMZ22003TZ/NOPB is rated for operation from -40°C to 125°C, but the maximum ambient temperature range depends on the specific application and the device's power dissipation. It's essential to ensure that the device operates within its recommended thermal specifications to ensure reliability.
  • Yes, the LMZ22003TZ/NOPB is suitable for high-reliability and aerospace applications. It's manufactured using a high-reliability process, and it's qualified to various industry standards, including MIL-PRF-38535 and NASA's EEE-INST-002. However, it's essential to consult with Texas Instruments' application engineers to ensure that the device meets the specific requirements of your application.
  • To troubleshoot issues with the LMZ22003TZ/NOPB, start by verifying that the device is properly powered and that the input and output voltages are within the recommended specifications. Check for any signs of overheating, and ensure that the device is operated within its recommended thermal specifications. If the issue persists, consult the datasheet and application notes, and consider consulting with Texas Instruments' application engineers for further assistance.

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LMZ22003TZ/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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