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LNK6765K - Power Integrations

Description: POWER INTEGRATIONS - LNK6765K - AC/DC CONVERTER, FLYBACK, ESOP-11

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PCB Footprints
LNK6765K - Power Integrations PCB footprint - Small Outline Packages - Small Outline Packages - eSOP-12B
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3D Models
LNK6765K - Power Integrations  - 3D model - Small Outline Packages - eSOP-12B
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LNK6765K Details

  • Manufacturer Part Number:

    LNK6765K

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Power Integrations

  • YTEOL:

    0

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • Peak Reflow Temperature (Cel):

    260

  • Time@Peak Reflow Temperature-Max (s):

    40

LNK6765K Frequently Asked Questions (FAQs)

  • The maximum output power of LNK6765K is dependent on the input voltage, output voltage, and thermal design. However, Power Integrations recommends a maximum output power of 65W for this device.
  • To ensure reliable start-up of LNK6765K, make sure to follow the recommended start-up sequence, provide a stable input voltage, and ensure that the output voltage is within the specified range. Additionally, ensure that the device is properly cooled and that the thermal design is adequate.
  • The BYPASS pin on LNK6765K is used to bypass the internal voltage regulator and allow the device to operate from an external voltage source. This can be useful in applications where a higher voltage is required or where the internal voltage regulator is not sufficient.
  • To optimize the design for minimum standby power consumption, ensure that the input voltage is minimized, use a high-efficiency transformer, and optimize the output voltage and current. Additionally, consider using a low-standby-power mode or a power-saving mode if available.
  • The recommended layout and placement for LNK6765K involves keeping the device away from heat sources, using a solid ground plane, and minimizing the distance between the device and the input and output capacitors. Additionally, ensure that the device is properly cooled and that the thermal design is adequate.

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