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LNK6769E - Power Integrations

Description: AC/DC Converters 118 W 85-265 VAC 153 W 230 VAC

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LNK6769E - Power Integrations PCB footprint - Other - Other - LNK6769E-3
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LNK6769E - Power Integrations  - 3D model - Other - LNK6769E-3
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LNK6769E Details

  • Manufacturer Part Number:

    LNK6769E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Power Integrations

  • YTEOL:

    8

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

LNK6769E Frequently Asked Questions (FAQs)

  • The maximum output power of LNK6769E depends on the input voltage, output voltage, and other design parameters. However, Power Integrations recommends a maximum output power of 65W for this device.
  • To ensure reliable start-up of the LNK6769E, make sure to follow the recommended start-up sequence, provide a stable input voltage, and ensure that the output voltage is within the specified range. Additionally, a soft-start circuit can be implemented to reduce inrush current and prevent voltage overshoot.
  • To minimize EMI, it is recommended to follow a compact PCB layout with a star-ground configuration, keep the high-frequency components (such as the transformer and switching FET) close together, and use a shielded transformer. Additionally, use a common-mode choke and a Y-capacitor to filter the output.
  • To select the right transformer for LNK6769E, consider the input voltage, output voltage, and power rating. Choose a transformer with a suitable turns ratio, core material, and winding configuration. Power Integrations provides a transformer design guide and a list of recommended transformers for LNK6769E.
  • The LNK6769E has a maximum junction temperature of 150°C. To ensure reliable operation, provide adequate heat sinking, use a thermal interface material, and ensure good airflow around the device. Monitor the device temperature and adjust the design as needed to prevent overheating.

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