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LP0701N3-G - Microchip

Description: P-Channel 16.5 V 500mA (Tj) 1W (Tc) Through Hole TO-92

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LP0701N3-G - Microchip - PCB symbol
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PCB Footprints
LP0701N3-G - Microchip PCB footprint - Other - Other - LP0701N3-G-3
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LP0701N3-G - Microchip - 3D model - Other - LP0701N3-G-3
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LP0701N3-G Details

  • Manufacturer Part Number:

    LP0701N3-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN PACKAGE-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-92-3

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    LOW THRESHOLD

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    16.5 V

  • Drain Current-Max (ID):

    0.5 A

  • Drain-source On Resistance-Max:

    1.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    60 pF

  • JEDEC-95 Code:

    TO-92

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation Ambient-Max:

    1 W

  • Power Dissipation-Max (Abs):

    1 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    TS 16949

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

LP0701N3-G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a robust power-on reset circuit, ensure a stable power supply, and consider using a thermistor or thermocouple to monitor temperature. Also, follow the recommended operating conditions and derating guidelines.
  • Use a shielded enclosure, ensure proper grounding and decoupling, and follow best practices for PCB layout and component placement. Also, consider using EMI filters or common-mode chokes if necessary.
  • Use a logic analyzer or oscilloscope to monitor signals, check for proper power supply and clock signals, and verify correct configuration and programming. Consult the datasheet and application notes for troubleshooting guides.
  • Consult the device's FMEDA report and safety manual for guidance on using the LP0701N3-G in safety-critical applications. Ensure compliance with relevant industry standards and regulations, such as IEC 61508 or ISO 26262.

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LP0701N3-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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