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LP8556TMX-E09/NOPB - Texas Instruments

Description: LED Lighting Drivers 6 Ch Hi-Eff/Eff LED Backlight Drvr

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LP8556TMX-E09/NOPB - Texas Instruments - PCB symbol
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PCB Footprints
LP8556TMX-E09/NOPB - Texas Instruments PCB footprint - BGA - BGA - YFQ0020x_2021
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LP8556TMX-E09/NOPB - Texas Instruments - 3D model - BGA - YFQ0020x_2021
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LP8556TMX-E09/NOPB Details

  • Manufacturer Part Number:

    LP8556TMX-E09/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Input Mode:

    SERIAL

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-XBGA-B20

  • JESD-609 Code:

    e1

  • Length:

    2.371 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Channels:

    6

  • Number of Functions:

    1

  • Number of Segments:

    12

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA20,4X5,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.675 mm

  • Supply Current-Max:

    3.65 mA

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.71 mm

  • fmax-Min:

    1.25 MHz

LP8556TMX-E09/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a thermal pad on the bottom of the device, connected to a copper plane on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to the copper plane.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the output current and voltage according to the device's thermal derating curve. Additionally, the device should be mounted on a heat sink or a thermally conductive PCB to dissipate heat.
  • Texas Instruments recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for optimal performance. The capacitor should be placed as close to the input pin as possible to minimize noise and ripple.
  • To troubleshoot issues with the device's enable pin, check that the enable pin is properly connected to a logic-level signal (e.g. 3.3V or 5V) and that the signal is not floating. Also, ensure that the enable pin is not being driven by a signal with a high impedance or a slow rise time.
  • Texas Instruments recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for optimal performance. The capacitor should be placed as close to the output pin as possible to minimize noise and ripple.

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LP8556TMX-E09/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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