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LP8758A2E3YFFR - Texas Instruments

Description: Switching Voltage Regulators Four-phase, four 4A output DC-DC step-down converters 35-DSBGA -40 to 85

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LP8758A2E3YFFR - Texas Instruments PCB footprint - BGA - BGA - YFF(R-XBGA-N35)
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LP8758A2E3YFFR - Texas Instruments  - 3D model - BGA - YFF(R-XBGA-N35)
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LP8758A2E3YFFR Details

  • Manufacturer Part Number:

    LP8758A2E3YFFR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2020-03-07

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO HAS PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.5 V

  • Input Voltage-Nom:

    3.7 V

  • JESD-30 Code:

    R-PBGA-B35

  • JESD-609 Code:

    e1

  • Length:

    2.88 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    4

  • Number of Terminals:

    35

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    4 A

  • Output Voltage-Max:

    3.36 V

  • Output Voltage-Min:

    0.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.625 mm

  • Supply Voltage-Nom (Vsup):

    3.7 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    3000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.13 mm

LP8758A2E3YFFR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Use the TI Power Designer software to configure the device and generate a configuration file. This tool helps optimize the device for your specific application and reduces design time.
  • The input and output capacitors, as well as the PCB layout, are critical components that affect the device's power supply noise rejection. Ensure that these components are properly selected and placed to minimize noise.
  • Check the power-good signal timing, voltage, and current. Ensure that the power-good signal is properly connected and that the device is properly configured. Use an oscilloscope to visualize the signal and identify any issues.
  • The device has a maximum junction temperature of 150°C. Ensure that the device is properly cooled, and the thermal pad is connected to a solid ground plane or a heat sink. Use thermal interface material to improve heat transfer.

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LP8758A2E3YFFR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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