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LP8864QDCPRQ1 - Texas Instruments

Description: LP8864 Q1 Automotive Display LED backlight with Four 200 mA Channels

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LP8864QDCPRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DCP0038A
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LP8864QDCPRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DCP0038A
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LP8864QDCPRQ1 Details

  • Manufacturer Part Number:

    LP8864QDCPRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HTSSOP-38

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2020-08-29

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G38

  • JESD-609 Code:

    e4

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Multiplexed Display Capability:

    NO

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Segments:

    28

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP38,.25,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • fmax-Min:

    2.2 MHz

LP8864QDCPRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the LP8864QDCPRQ1 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces to reduce EMI and noise. TI provides a recommended PCB layout in the datasheet and application notes.
  • The choice of input and output capacitors depends on the specific application requirements, such as voltage rating, capacitance value, and ESR. TI recommends using low-ESR capacitors with a voltage rating of at least 2x the input voltage, and a capacitance value of 10uF to 22uF for the input capacitor and 10uF to 47uF for the output capacitor.
  • The LP8864QDCPRQ1 is rated for operation from -40°C to 125°C, but the maximum ambient temperature range depends on the specific application and the device's power dissipation. TI recommends derating the device's power dissipation at high temperatures to ensure reliable operation.
  • To ensure stability, follow the recommended PCB layout, use a sufficient output capacitor, and ensure the device is properly decoupled. TI also recommends adding a small ceramic capacitor (e.g., 10nF) between the VIN and GND pins to improve stability.
  • The LP8864QDCPRQ1 is capable of delivering up to 2A of output current, but the maximum output current depends on the input voltage, output voltage, and ambient temperature. TI recommends checking the device's thermal performance and power dissipation to ensure reliable operation.

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LP8864QDCPRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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