Part Image

LP8900TLE-3333/NOPB - Texas Instruments

Description: 200-mA Ultra-Low-Noise Dual LDO for RF and Analog Circuits

Download LP8900TLE-3333/NOPB Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
LP8900TLE-3333/NOPB - Texas Instruments PCB footprint - BGA - BGA - YZR0006xx
click to zoom
3D Models
LP8900TLE-3333/NOPB - Texas Instruments  - 3D model - BGA - YZR0006xx
click to zoom

LP8900TLE-3333/NOPB Details

  • Manufacturer Part Number:

    LP8900TLE-3333/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.164 V

  • Dropout Voltage1-Nom:

    0.11 V

  • Dropout Voltage2-Max:

    0.164 V

  • Input Voltage Absolute-Max:

    6.5 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3.3 V

  • JESD-30 Code:

    R-XBGA-B6

  • JESD-609 Code:

    e1

  • Length:

    1.46 mm

  • Load Regulation-Max:

    0.009%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.2 A

  • Output Current2-Max:

    0.2 A

  • Output Voltage1-Max:

    2.863 V

  • Output Voltage1-Min:

    2.737 V

  • Output Voltage1-Nom:

    3.3 V

  • Output Voltage2-Max:

    2.863 V

  • Output Voltage2-Min:

    2.737 V

  • Output Voltage2-Nom:

    2.8 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.675 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    1%

  • Width:

    1.06 mm

LP8900TLE-3333/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout for the LP8900TLE-3333/NOPB in the datasheet, but it's also recommended to follow general guidelines for thermal management, such as using a solid ground plane, placing thermal vias under the device, and keeping the PCB layer stack-up symmetrical.
  • The LP8900TLE-3333/NOPB has a specific power-up sequence and configuration requirements. It's essential to follow the recommended power-up sequence and configuration guidelines in the datasheet, and to ensure that the device is properly reset and configured during startup.
  • Using a different inductor value or type than recommended can affect the performance and efficiency of the device. It's essential to follow the recommended inductor specifications in the datasheet, as they are optimized for the device's operating conditions. Deviating from these specifications can lead to reduced efficiency, increased noise, or even device failure.
  • Troubleshooting issues with the LP8900TLE-3333/NOPB requires a systematic approach. Start by reviewing the datasheet and application notes, and then use tools such as oscilloscopes and logic analyzers to debug the issue. Texas Instruments also provides support resources, such as forums and technical support teams, to help resolve issues.
  • The LP8900TLE-3333/NOPB has a maximum junction temperature rating of 150°C. To ensure reliable operation, it's essential to derate the device's power dissipation based on the ambient temperature and PCB layout. Texas Instruments provides thermal derating guidelines in the datasheet, which should be followed to ensure the device operates within its recommended specifications.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

LP8900TLE-3333/NOPB Overview

Use the download button to access the LP8900TLE-3333/NOPB schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LP890, or try a keyword search, such as Linear Regulator ICs

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to LP8900TLE-3333/NOPB

Showing 0 results

LP8900TLE-3333/NOPB Alternates

Showing results

Image Part Number Model
Part Image LP8900TLX-3333/NOPB Texas Instruments

Fixed Positive LDO Regulator, 2 Output, 2.8V1, 2.8V2, CMOS, PBGA6

Part Image LP8900TLE-3333 Texas Instruments

Fixed Positive LDO Regulator, 2 Output, 2.8V1, 2.8V2, PBGA6

Part Image LP8900TLX-3333 Texas Instruments

Fixed Positive LDO Regulator, 2 Output, 2.8V1, 2.8V2, PBGA6