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LSF0204QPWRQ1 - Texas Instruments

Description: Automotive 4-Bit Bidirectional Multi-Voltage Level Translator for Open-Drain or Push- Pull Interface

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LSF0204QPWRQ1 - Texas Instruments - PCB symbol
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PCB Footprints
LSF0204QPWRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - 14-Pin TSSOP-ren1
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3D Models
LSF0204QPWRQ1 - Texas Instruments - 3D model - Small Outline Packages - 14-Pin TSSOP-ren1
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LSF0204QPWRQ1 Details

  • Manufacturer Part Number:

    LSF0204QPWRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-07-13

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Delay-Max:

    6.7 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    0.004 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    0.9 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LSF0204QPWRQ1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal protection and overcurrent protection circuits.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure that the device is operated within the recommended temperature range to prevent overheating.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect against electrostatic discharge. Follow proper PCB design and layout guidelines to minimize ESD susceptibility.
  • For high-frequency operation, ensure that the PCB is designed to minimize parasitic inductance and capacitance. Use a low-ESR capacitor for decoupling, and consider using a ferrite bead or common-mode choke to filter high-frequency noise.

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LSF0204QPWRQ1 Overview

Use the download button to access the LSF0204QPWRQ1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LSF02, or try a keyword search, such as Level Translators

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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