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LT1962EMS8-2.5 - Analog Devices

Description: LDO Regulator Pos 2.5V 0.3A Automotive 8-Pin MSOP

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LT1962EMS8-2.5 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSOP8
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LT1962EMS8-2.5 - Analog Devices - 3D model - Small Outline Packages - MSOP8
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LT1962EMS8-2.5 Details

  • Manufacturer Part Number:

    LT1962EMS8-2.5

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, MSOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.43 V

  • Dropout Voltage1-Nom:

    0.5 V

  • Input Voltage Absolute-Max:

    20 V

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    3 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e0

  • Length:

    3 mm

  • Line Regulation-Max:

    0.005%

  • Load Regulation-Max:

    0.025%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    2.565 V

  • Output Voltage1-Min:

    2.435 V

  • Output Voltage1-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Voltage Tolerance-Max:

    2.6%

  • Width:

    3 mm

LT1962EMS8-2.5 Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1962EMS8-2.5 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and EMI. A 4-layer PCB with a dedicated power plane and a separate ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended compensation network and output capacitor values. Additionally, ensure that the input and output capacitors are of high quality and have low ESR. A minimum output capacitance of 10uF is recommended, and the output capacitor should be placed close to the device.
  • The LT1962EMS8-2.5 has an operating ambient temperature range of -40°C to 125°C. However, the device's performance and reliability may degrade at extreme temperatures. It's essential to ensure proper thermal management and heat sinking to maintain a safe operating temperature.
  • The LT1962EMS8-2.5 is a commercial-grade device, and its reliability and performance may not meet the requirements of high-reliability or aerospace applications. For such applications, it's recommended to use a device that is specifically designed and qualified for high-reliability or aerospace use, such as the LT1962HMS8-2.5.
  • To protect the LT1962EMS8-2.5 from input voltage transients and surges, it's recommended to use a TVS (Transient Voltage Suppressor) diode or a voltage clamp circuit at the input. Additionally, ensure that the input capacitor is rated for the maximum expected input voltage and has a low ESR.

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LT1962EMS8-2.5 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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