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LT3652EMSE#TRPBF - Analog Devices

Description: Battery Management Pwr Track 2A Bat Chr for Solar Pwr

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LT3652EMSE#TRPBF - Analog Devices - PCB symbol
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PCB Footprints
LT3652EMSE#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 12-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1666 Rev F)
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3D Models
LT3652EMSE#TRPBF - Analog Devices - 3D model - Small Outline Packages - MSE Package 12-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1666 Rev F)
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LT3652EMSE#TRPBF Details

  • Manufacturer Part Number:

    LT3652EMSE#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    05-08-1666

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    R-PDSO-G12

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP12,.19

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    32 V

  • Supply Voltage-Min (Vsup):

    4.95 V

  • Supply Voltage-Nom (Vsup):

    20 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LT3652EMSE#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT3652EMSE involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing the length of the high-current paths. A 4-layer PCB with a dedicated power plane is recommended.
  • To optimize the inductor selection, consider the inductor's saturation current, DC resistance, and core material. A good starting point is to choose an inductor with a saturation current rating of at least 1.5 times the maximum output current, and a DC resistance of less than 100 mΩ.
  • The maximum ambient temperature for the LT3652EMSE is 85°C, but it can be derated to 70°C for high-reliability applications. It's essential to ensure good airflow and heat sinking to maintain a safe operating temperature.
  • Yes, the LT3652EMSE is designed to withstand high-vibration environments. However, it's essential to ensure that the PCB is securely fastened, and the components are properly soldered to prevent mechanical stress and vibration-induced failures.
  • Common issues with the LT3652EMSE include output voltage instability, overheating, and input voltage undershoot. To troubleshoot, check the input voltage, output voltage, and current sense resistors. Verify that the PCB layout and component selection meet the recommended guidelines.

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LT3652EMSE#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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