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LT6650CS5#TRMPBF - Analog Devices

Description: LT6650 400mV voltage reference SOT23 LT6650CS5#TRMPBF, Voltage Reference 0.4V 18 V max. 5-Pin TSOT-23

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LT6650CS5#TRMPBF - Analog Devices PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5 Lead Plastic TSOT-23
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LT6650CS5#TRMPBF - Analog Devices  - 3D model - SOT23 (5-Pin) - 5 Lead Plastic TSOT-23
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LT6650CS5#TRMPBF Details

  • Manufacturer Part Number:

    LT6650CS5#TRMPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOT-23, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    05-08-1635

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    70 °C

  • Output Voltage-Max:

    0.403 V

  • Output Voltage-Min:

    0.397 V

  • Output Voltage-Nom:

    0.4 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    1.4 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    YES

  • Width:

    1.625 mm

LT6650CS5#TRMPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT6650CS5 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the output capacitor has a low ESR and is properly decoupled from the input capacitor. Additionally, avoid using capacitors with high ESL values.
  • The maximum input voltage that the LT6650CS5 can handle is 12V. Exceeding this voltage may damage the device. It's recommended to add input voltage protection, such as a voltage regulator or a TVS diode, to prevent overvoltage conditions.
  • The LT6650CS5 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's performance and consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe operating temperature.
  • To troubleshoot issues with the LT6650CS5, start by verifying the input voltage and current, and checking for any signs of overheating. Use an oscilloscope to check the output voltage and current waveforms. Also, ensure that the device is properly decoupled and that the PCB layout is correct. Consult the datasheet and application notes for more troubleshooting guidance.

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LT6650CS5#TRMPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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