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LT8584EFE#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LT8584EFE#PBF - IC, MONOLITHIC CELL BALANCER, TSSOP-16

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LT8584EFE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - LT8584EFE#PBFaaa
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LT8584EFE#PBF Details

  • Manufacturer Part Number:

    LT8584EFE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1663 (BC)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    BATTERY PROTECTOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.3 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    4.2 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LT8584EFE#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT8584EFE#PBF involves keeping the input and output capacitors close to the IC, using a solid ground plane, and separating the analog and digital grounds. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, make sure to decouple the input and output with suitable capacitors, and use a low-ESR output capacitor. Also, ensure that the feedback network is properly compensated, and the loop gain is sufficient.
  • The LT8584EFE#PBF is rated for operation from -40°C to 125°C. However, the maximum ambient temperature range may vary depending on the specific application and thermal design. It's essential to ensure proper thermal management and heat sinking to maintain a safe operating temperature.
  • Yes, the LT8584EFE#PBF is suitable for high-reliability and automotive applications. It's manufactured using a high-reliability process, and it's qualified to the AEC-Q100 standard for automotive applications. However, it's essential to follow the recommended design and testing guidelines to ensure the required level of reliability.
  • To troubleshoot common issues with the LT8584EFE#PBF, start by verifying the PCB layout and component values against the recommended design guidelines. Check for any signs of oscillations, such as ringing on the output or input, and ensure that the feedback network is properly compensated. Also, verify that the input and output capacitors are suitable for the application, and that the thermal design is adequate.

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LT8584EFE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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