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LT8584HFE#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LT8584HFE#PBF - IC, MONOLITHIC CELL BALANCER, TSSOP-16

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LT8584HFE#PBF - Analog Devices - PCB symbol
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PCB Footprints
LT8584HFE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - FE Package 16-Lead Plastic TSSOP (4.4mm
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LT8584HFE#PBF - Analog Devices - 3D model - Small Outline Packages - FE Package 16-Lead Plastic TSSOP (4.4mm
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LT8584HFE#PBF Details

  • Manufacturer Part Number:

    LT8584HFE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1663 (BC)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    BATTERY PROTECTOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.3 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    4.2 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LT8584HFE#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT8584HFE involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing the length of the traces between the IC and the capacitors. Additionally, it's recommended to use a separate analog and digital ground plane to reduce noise coupling.
  • To ensure stability, make sure to follow the recommended component values and layout guidelines in the datasheet. Additionally, ensure that the input and output capacitors are of high quality and have low ESR. Also, avoid using long traces and vias in the feedback loop, and keep the feedback resistors close to the IC.
  • The LT8584HFE can operate in ambient temperatures up to 125°C, but the junction temperature should not exceed 150°C. It's recommended to use a heat sink or thermal management techniques to keep the junction temperature within the recommended range.
  • Yes, the LT8584HFE is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard for automotive grade and is also suitable for industrial and medical applications that require high reliability.
  • To troubleshoot issues with the LT8584HFE, start by checking the input and output voltages, and ensure that the input voltage is within the recommended range. Check the feedback loop for any signs of oscillation or instability. Also, verify that the component values and layout meet the recommended guidelines in the datasheet.

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LT8584HFE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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