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LTC1755EGN#PBF - Analog Devices

Description: LTC1755EGN#PBF, Peripheral Controller Universal Smart Card 2.7 → 6 V 24-Pin SSOP

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LTC1755EGN#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - GN_(SSOP)
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LTC1755EGN#PBF - Analog Devices  - 3D model - Small Outline Packages - GN_(SSOP)
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LTC1755EGN#PBF Details

  • Manufacturer Part Number:

    LTC1755EGN#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, PLASTIC, SSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    05-08-1641 (GN24)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP24,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9116 mm

LTC1755EGN#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC1755EGN involves keeping the power traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer board with a dedicated power plane and a solid ground plane is recommended. Additionally, it's essential to follow the layout guidelines provided in the datasheet and application notes.
  • To ensure stability, it's crucial to follow the compensation guidelines provided in the datasheet. This includes selecting the correct compensation components (R1, R2, C1, and C2) based on the output voltage and load current. Additionally, make sure to place the compensation components close to the device and use a low-ESR output capacitor.
  • The maximum input voltage for the LTC1755EGN is 15V. However, it's recommended to operate the device within the specified input voltage range (4.5V to 12V) to ensure reliable operation and to prevent damage to the device.
  • The LTC1755EGN is rated for operation up to 125°C junction temperature. However, it's essential to consider the thermal management of the device, especially in high-temperature environments. Make sure to provide adequate heat sinking and follow the thermal design guidelines provided in the datasheet.
  • To troubleshoot issues with the LTC1755EGN, start by verifying the input voltage, output voltage, and load current. Check for any signs of overheating, and ensure that the device is properly soldered and connected. Use an oscilloscope to check for any oscillations or noise on the output. If the issue persists, consult the datasheet and application notes for guidance, or contact Analog Devices' technical support.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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