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LTC1863IGN#TRPBF - Analog Devices

Description: Analog to Digital Converters - ADC 12-bit, 8-ch. Serial, Micropower ADC

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LTC1863IGN#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - ssop16
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LTC1863IGN#TRPBF Details

  • Manufacturer Part Number:

    LTC1863IGN#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1641 (GN16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    2.048 V

  • Analog Input Voltage-Min:

    -2.048 V

  • Conversion Time-Max:

    3.5 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    8

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.2 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1.8 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.899 mm

LTC1863IGN#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC1863IGN involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the IC close to the analog input pins. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure accurate voltage measurements, it's essential to use a high-impedance input source, minimize noise and interference, and use a low-noise, low-impedance analog input pin. Additionally, it's recommended to use a voltage reference pin (VREF) to improve accuracy.
  • The maximum sampling rate of the LTC1863IGN is 250ksps (kilo-samples per second). However, the actual sampling rate may vary depending on the system clock frequency and the specific application.
  • Yes, the LTC1863IGN can be used in a multi-channel application. The IC has a built-in multiplexer that allows it to measure multiple channels. However, the number of channels and the channel switching time will depend on the specific application and the system clock frequency.
  • Calibration of the LTC1863IGN involves adjusting the offset and gain of the ADC to match the specific application requirements. This can be done using the IC's built-in calibration registers or through external calibration techniques such as system-level calibration or self-calibration.

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LTC1863IGN#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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