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LTC1863LIGN#WPBF - Analog Devices

Description: Micropower, 3V, 12-bit, 8-Channel 175ksps ADCs

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LTC1863LIGN#WPBF - Analog Devices - PCB symbol
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PCB Footprints
LTC1863LIGN#WPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - GN Package 16-Lead Plastic SSOP (Narrow .150 Inch)
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3D Models
LTC1863LIGN#WPBF - Analog Devices - 3D model - Small Outline Packages - GN Package 16-Lead Plastic SSOP (Narrow .150 Inch)
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LTC1863LIGN#WPBF Details

  • Manufacturer Part Number:

    LTC1863LIGN#WPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1641 (GN16)

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog Input Voltage-Max:

    1.25 V

  • Analog Input Voltage-Min:

    -1.25 V

  • Conversion Time-Max:

    3.7 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.8895 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    8

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    0.175 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.899 mm

LTC1863LIGN#WPBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC1863LIGN#WPBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and to avoid routing digital signals near the analog inputs.
  • To ensure accuracy and stability of the ADC conversion results, it's essential to follow proper PCB layout and design guidelines, use a stable and low-noise power supply, and ensure that the analog input signals are properly filtered and buffered. Additionally, it's recommended to use the internal reference voltage and to calibrate the ADC periodically to compensate for any drift or offset.
  • The maximum sampling rate of the LTC1863LIGN#WPBF is 1.5Msps, and it can be achieved by using the internal clock and setting the appropriate clock frequency. The power consumption of the device increases with the sampling rate, so it's essential to balance the sampling rate with the power consumption requirements of the application.
  • The LTC1863LIGN#WPBF can be interfaced with a microcontroller or FPGA using the SPI or I2C communication protocols. The recommended protocol depends on the specific application requirements, but SPI is generally faster and more suitable for high-speed applications. It's essential to follow the protocol guidelines and to use the appropriate clock frequency and data transfer rates.
  • The LTC1863LIGN#WPBF has a maximum operating temperature of 125°C, and it's essential to ensure that the device is properly heat-sinked and that the PCB is designed to dissipate heat efficiently. It's recommended to use a thermal pad or heat sink on the device, and to ensure that the ambient temperature is within the specified range.

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LTC1863LIGN#WPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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