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LTC2051HVIS8#PBF - Analog Devices

Description: Linear Technology LTC2051HVIS8#PBF, Dual Zero Drift Op Amp, 3MHz Rail-Rail, 2.7 V, 8-Pin SOIC

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LTC2051HVIS8#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Plastic Small Outline (Narrow .150 Inch)
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LTC2051HVIS8#PBF Details

  • Manufacturer Part Number:

    LTC2051HVIS8#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1610 (S8)

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Average Bias Current-Max (IIB):

    0.0003 µA

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Input Offset Voltage-Max:

    3 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    2 V/us

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Width:

    3.9 mm

LTC2051HVIS8#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2051HVIS8 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To optimize the performance of the LTC2051HVIS8 in high-frequency applications, use a low-ESR input capacitor, minimize the input and output trace lengths, and use a high-frequency-compatible PCB material. Additionally, consider using a ferrite bead or a series resistor to filter out high-frequency noise.
  • The maximum power dissipation of the LTC2051HVIS8 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this can be derated to 0.7W at 85°C ambient temperature.
  • The LTC2051HVIS8 is rated for operation from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the power dissipation and consider using a heat sink or a thermally-enhanced package if operating in high-temperature environments.
  • Common issues with the LTC2051HVIS8 include oscillations, noise, and output voltage errors. To troubleshoot these issues, check the PCB layout, input and output capacitor values, and the device's thermal performance. Also, ensure that the input voltage is within the recommended range and that the device is not overheating.

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LTC2051HVIS8#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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