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LTC2225CUH#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LTC2225CUH#PBF - Analogue to Digital Converter, 12 bit, 10 MSPS, Differential, Single Ended, Parallel, Single, 2.7 V

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LTC2225CUH#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UH Package 32-Lead Plastic QFN (5mm × 5mm)_2022
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LTC2225CUH#PBF - Analog Devices  - 3D model - Quad Flat No-Lead - UH Package 32-Lead Plastic QFN (5mm × 5mm)_2022
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LTC2225CUH#PBF Details

  • Manufacturer Part Number:

    LTC2225CUH#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQCCN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    05-08-1693

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    1 V

  • Analog Input Voltage-Min:

    -1 V

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Linearity Error-Max (EL):

    0.0269%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    10 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

LTC2225CUH#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2225CUH involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the input traces. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, a minimum of 10uF capacitance is recommended at the output.
  • The maximum allowed input voltage for the LTC2225CUH is 5.5V. Exceeding this voltage may damage the device.
  • The LTC2225CUH is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's performance and consider using a heat sink if operating in high-temperature environments.
  • To troubleshoot issues with the LTC2225CUH, start by checking the input voltage, output voltage, and current consumption. Verify that the device is properly soldered and that the PCB layout is correct. Use an oscilloscope to check for oscillations or noise on the output. Consult the datasheet and application notes for more troubleshooting guidance.

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LTC2225CUH#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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