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LTC2246HLX#PBF - Analog Devices

Description: 14-Bit, 25Msps 125°C ADC In LQFP

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LTC2246HLX#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTC2246HLX#PBF - Analog Devices PCB footprint - Quad Flat Packages - Quad Flat Packages - LX Package 48-Lead Plastic LQFP (7mm × 7mm)
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3D Models
LTC2246HLX#PBF - Analog Devices - 3D model - Quad Flat Packages - LX Package 48-Lead Plastic LQFP (7mm × 7mm)
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LTC2246HLX#PBF Details

  • Manufacturer Part Number:

    LTC2246HLX#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQCCN-32

  • Pin Count:

    48

  • Manufacturer Package Code:

    05-08-1760

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    3A991.C.3

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Input Voltage-Max:

    1.9 V

  • Analog Input Voltage-Min:

    1 V

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    1

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    70 °C

  • Output Bit Code:

    OFFSET BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    40 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

LTC2246HLX#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2246 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the input traces. Additionally, it's recommended to place the device close to the analog signal sources and to use a low-ESR capacitor for the VCC pin.
  • The LTC2246 requires a single 1.8V to 3.3V power supply. It's recommended to power the device with a low-noise, low-dropout regulator. The power sequencing requirement is to power up the VCC pin before the analog input signals, and to power down the VCC pin after the analog input signals.
  • The maximum clock frequency that can be used with the LTC2246 is 80 MSPS. However, the actual clock frequency used may be limited by the specific application and the analog input signal bandwidth.
  • To optimize the performance of the LTC2246, it's recommended to use a low-noise, low-impedance analog input source, to minimize the input capacitance, and to use a high-quality clock source. Additionally, the device should be operated within its recommended operating conditions, and the analog input signals should be properly filtered and amplified.
  • The recommended operating temperature range for the LTC2246 is -40°C to 85°C. However, the device can operate over a wider temperature range, but the performance may be affected.

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LTC2246HLX#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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