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LTC2323IUFD-16#PBF - Analog Devices

Description: Analog to Digital Converters - ADC Dual, 16-Bit, 5Msps SAR ADC with Wide Common Mode Range

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LTC2323IUFD-16#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTC2323IUFD-16#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UFD 28-Lead Plastic QFN (4mm × 5mm)
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3D Models
LTC2323IUFD-16#PBF - Analog Devices - 3D model - Quad Flat No-Lead - UFD 28-Lead Plastic QFN (4mm × 5mm)
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LTC2323IUFD-16#PBF Details

  • Manufacturer Part Number:

    LTC2323IUFD-16#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    05-08-1712

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    3A991.C.4

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    2.053 V

  • Analog Input Voltage-Min:

    -2.044 V

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PQCC-N28

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Linearity Error-Max (EL):

    0.0183%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    2

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.16X.2,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    5 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    18 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

LTC2323IUFD-16#PBF Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the analog and digital signals separate. Additionally, use short traces and avoid crossing analog and digital signals.
  • The LTC2323IUFD-16#PBF has an internal calibration circuit that is performed at power-up. However, it's recommended to perform an external calibration using an external voltage reference and a calibration signal to ensure optimal accuracy.
  • The maximum sampling rate of the LTC2323IUFD-16#PBF is 1.5Msps. However, the actual sampling rate may be limited by the system's clock frequency, the analog input bandwidth, and the digital output data rate.
  • The LTC2323IUFD-16#PBF has internal overvoltage protection up to 7V. However, it's recommended to use external protection circuits, such as voltage limiters or clamp circuits, to protect the device from overvoltage and undervoltage conditions.
  • The typical power consumption of the LTC2323IUFD-16#PBF is 35mW. To minimize power consumption, use the device's power-down mode, reduce the clock frequency, and optimize the analog input range to reduce the power consumption.

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LTC2323IUFD-16#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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